| Date: | 2020/05/27 |
|---|---|
| Document No. | 10900056801 |
| Title: | TSMC 3rd Unsecured Corporate Bonds Issue In 2020 will be listed on the TPEx from May 29, 2020. |
| Description: | 1.Issuer: Taiwan Semiconductor Manufacturing Co., Ltd. 2.Bond Name: TSMC 3rd Unsecured Corporate Bond-A Issue In 2020 (1)Code: B618BT (2)Issue amount: TWD4.5 billion (3)Issue price: 100% (4)Issue date: May 29, 2020 (5)Maturity date: May 29, 2025 (6)Tenor: 5 years (7)Coupon rate: 0.55% (8)The bond is subject to selling restrictions. 3.Bond Name: TSMC 3rd Unsecured Corporate Bond-B Issue In 2020 (9)Code: B618BU (10)Issue amount: TWD7.5 billion (11)Issue price: 100% (12)Issue date: May 29, 2020 (13)Maturity date: May 29, 2027 (14)Tenor: 7 years (15)Coupon rate: 0.6% (16)The bond is subject to selling restrictions. 4.Bond Name: TSMC 3rd Unsecured Corporate Bond-C Issue In 2020 (17)Code: B618BV (18)Issue amount: TWD2.4 billion (19)Issue price: 100% (20)Issue date: May 29, 2020 (21)Maturity date: May 29, 2030 (22)Tenor: 10 years (23)Coupon rate: 0.64% (24)The bond is subject to selling restrictions. 5.For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |