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Date: 2020/11/20
Document No. 10900137712
Title: ULTRACHIP Co., Ltd. 1st Domestic Secured Convertible Bond will be listed on the TPEx from November 25, 2020.
Description: 1.Issuer: Ultra Chip, Inc.
(1)Bond name: ULTRACHIP Co., Ltd. 1st Domestic Secured Convertible Bond
(2)Code: 31411
(3)Issue amount: TWD 350 million
(4)Issue price: 101% (TWD 101)
(5)Issue date: November 25, 2020
(6)Maturity date: November 25, 2023
(7)Tenor: 3 years
(8)Coupon rate: 0%
2.For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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