Date: | 2020/11/20 |
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Document No. | 10900137712 |
Title: | ULTRACHIP Co., Ltd. 1st Domestic Secured Convertible Bond will be listed on the TPEx from November 25, 2020. |
Description: | 1.Issuer: Ultra Chip, Inc. (1)Bond name: ULTRACHIP Co., Ltd. 1st Domestic Secured Convertible Bond (2)Code: 31411 (3)Issue amount: TWD 350 million (4)Issue price: 101% (TWD 101) (5)Issue date: November 25, 2020 (6)Maturity date: November 25, 2023 (7)Tenor: 3 years (8)Coupon rate: 0% 2.For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |