| Date: | 2020/11/26 |
|---|---|
| Document No. | 10900139511 |
| Title: | TSMC 6th Unsecured Corporate Bond in 2020, with 3 tranches, will be listed on the TPEx from December 2, 2020. |
| Description: | 1.Issuer: Taiwan Semiconductor Manufacturing Co., Ltd. 2.Bond Name: TSMC 6th Unsecured Corporate Bond in 2020-Tranche A (1)Code: B618C3 (2)Issue amount: TWD 1.6 billion (3)Issue price: 100% (4)Issue date: December 2, 2020 (5)Maturity date: December 2, 2025 (6)Tenor: 5 years (7)Coupon rate: 0.4% (8)The bond is subject to selling restrictions. (9)The bond has been acquired green bond accreditation, and will be listed on the TPEx as green bonds. 3.Bond Name: TSMC 6th Unsecured Corporate Bond in 2020-Tranche B (1)Code: B618C4 (2)Issue amount: TWD 5.6 billion (3)Issue price: 100% (4)Issue date: December 2, 2020 (5)Maturity date: December 2, 2027 (6)Tenor: 7 years (7)Coupon rate: 0.44% (8)The bond is subject to selling restrictions. (9)The bond has been acquired green bond accreditation, and will be listed on the TPEx as green bonds. 4.Bond Name: TSMC 6th Unsecured Corporate Bond in 2020-Tranche C (1)Code: B618C5 (2)Issue amount: TWD 4.8 billion (3)Issue price: 100% (4)Issue date: December 2, 2020 (5)Maturity date: December 2, 2030 (6)Tenor: 10 years (7)Coupon rate: 0.48% (8)The bond is subject to selling restrictions. (9)The bond has been acquired green bond accreditation, and will be listed on the TPEx as green bonds. 5.For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |