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Date: 2021/10/01
Document No. 11000110791
Title: TSMC 6th Unsecured Corporate Bond in 2021 with 4 tranches will be listed on TPEx from October 5, 2021.
Description: 1. Issuer: Taiwan Semiconductor Manufacturing Co., Ltd.
2. Bond Name: TSMC 6th Unsecured Corporate Bond in 2021-Tranche A
(1) Code: B618CN
(2) Issue amount: TWD 3.2 billion
(3) Issue price: 100%
(4) Issue date: October 5, 2021
(5) Maturity date: April 5, 2026
(6) Tenor: 4 years and 6 months
(7) Coupon rate: 0.535%
(8) The bond is subject to selling restrictions.
3. Bond Name: TSMC 6th Unsecured Corporate Bond in 2021-Tranche B
(1) Code: B618CP
(2) Issue amount: TWD 6.9 billion
(3) Issue price: 100%
(4) Issue date: October 5, 2021
(5) Maturity date: October 5, 2026
(6) Tenor: 5 Years
(7) Coupon rate: 0.54%
(8) The bond is subject to selling restrictions.
4. Bond Name: TSMC 6th Unsecured Corporate Bond in 2021-Tranche C
(1) Code: B618CQ
(2) Issue amount: TWD 4.6 billion
(3) Issue price: 100%
(4) Issue date: October 5, 2021
(5) Maturity date: October 5, 2028
(6) Tenor: 7 Years
(7) Coupon rate: 0.60%
(8) The bond is subject to selling restrictions.
5. Bond Name: TSMC 6th Unsecured Corporate Bond in 2021-Tranche D
(1) Code: B618CR
(2) Issue amount: TWD 1.6 billion
(3) Issue price: 100%
(4) Issue date: October 5, 2021
(5) Maturity date: October 5, 2031
(6) Tenor: 10 Years
(7) Coupon rate: 0.62%
(8) The bond is subject to selling restrictions.
6. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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