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Date: 2021/10/07
Document No. 11000113401
Title: SIGURD MICROELECTRONICS CORP. Fourth UnSecured Convertible Bond will be listed on the TPEx from October 13, 2021.
Description: 1. Issuer: SIGURD MICROELECTRONICS CORP.
2. Bond name: SIGURD MICROELECTRONICS CORP. Fourth UnSecured Convertible Bond
(1) Code: 62574
(2) Issue amount: TWD 1.5 billion
(3) Issue price: 106.20% (TWD 106.20)
(4) Issue date: October 13, 2021
(5) Maturity date: October 13, 2024
(6) Tenor: 3 years
(7) Coupon rate: 0%
3. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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