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Date: 2023/03/16
Document No. 11200012071
Title: THINTECH MATERIALS TECHNOLOGY CO., LTD. 3rd Secured Convertible Bond will be listed on the TPEx from March 21, 2023.
Description: 1. Issuer: THINTECH MATERIALS TECHNOLOGY CO., LTD.
(1) Bond name: THINTECH MATERIALS TECHNOLOGY CO., LTD. 3rd Secured Convertible Bond
(2) Code: 36633
(3) Issue amount: TWD 200 Million
(4) Issue price: 109.8% (TWD 109.8)
(5) Issue date: March 21, 2023
(6) Maturity date: March 21, 2026
(7) Tenor: 3 years
(8) Coupon rate: 0%
2. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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