Date: | 2023/03/16 |
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Document No. | 11200012071 |
Title: | THINTECH MATERIALS TECHNOLOGY CO., LTD. 3rd Secured Convertible Bond will be listed on the TPEx from March 21, 2023. |
Description: | 1. Issuer: THINTECH MATERIALS TECHNOLOGY CO., LTD. (1) Bond name: THINTECH MATERIALS TECHNOLOGY CO., LTD. 3rd Secured Convertible Bond (2) Code: 36633 (3) Issue amount: TWD 200 Million (4) Issue price: 109.8% (TWD 109.8) (5) Issue date: March 21, 2023 (6) Maturity date: March 21, 2026 (7) Tenor: 3 years (8) Coupon rate: 0% 2. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |