| Date: | 2023/03/21 |
|---|---|
| Document No. | 11200014561 |
| Title: | HFC Ltd. 1st Unsecured Corporate Bond Issue in 2023 will be listed on TPEx from March 28, 2023. |
| Description: | 1. Issuer: HOTAI FINANCE CO., LTD. 2. Bond Name: HFC Ltd. 1st Unsecured Corporate Bond Issue in 2023 (1) Code: B86909 (2) Issue amount: TWD 4 billion (3) Issue price: 100% (4) Issue date: March 28, 2023 (5) Maturity date: March 28, 2028 (6) Tenor: 5 years (7) Coupon rate: 1.5% (8) The bond is subject to selling restrictions. 3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |