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Market Announcement
DA-LI DEVELOPMENT CO.,LTD. 2st Secured Corporate Bond Issue in 2021 will be listed on the TPEx from August 5, 2021.
Date: 2021/07/29
1. Issuer: DA-LI DEVELOPMENT CO., LTD.
2. Bond Name: DA-LI DEVELOPMENT CO.,LTD. 2st Secured Corporate Bond Issue in 2021
(1) Code: B85309
(2) Issue amount: TWD 1 billion
(3) Issue price: 100%
(4) Issue date: August 5, 2021
(5) Maturity date: August 5, 2026
(6) Tenor: 5 years
(7) Coupon rate: 0.55%
(8) The bond is subject to selling restrictions.
3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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