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Taipei Exchange

   Education Seminars in H2 2021 will change to webinar and be broadcasted live.       Live stream: TPEx will hold a Brillian Network & Automation Integrated Syst (stock code: 6788) Listing Ceremony       TPEx “ETN Reward Program” Kicks off       TPEx “Bond ETF Reward Program” Kicks off   
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Market Announcement

DA-LI DEVELOPMENT CO.,LTD. 2st Secured Corporate Bond Issue in 2021 will be listed on the TPEx from August 5, 2021.

Date: 2021/07/29

1. Issuer: DA-LI DEVELOPMENT CO., LTD.
2. Bond Name: DA-LI DEVELOPMENT CO.,LTD. 2st Secured Corporate Bond Issue in 2021
(1) Code: B85309
(2) Issue amount: TWD 1 billion
(3) Issue price: 100%
(4) Issue date: August 5, 2021
(5) Maturity date: August 5, 2026
(6) Tenor: 5 years
(7) Coupon rate: 0.55%
(8) The bond is subject to selling restrictions.
3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).