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Market Announcement
RADIUM LIFE TECH. CO., LTD. 1st Secured Corporate Bond Issue in 2021 will be listed on the TPEx from August 02, 2021.
Date: 2021/07/29
1. Issuer: RADIUM LIFE TECH. CO.,LTD
2. Bond Name: RADIUM LIFE TECH. CO., LTD. 1st Secured Corporate Bond Issue in 2021
(1) Code: B87107
(2) Issue amount: TWD 0.50 Billion
(3) Issue price: 100%
(4) Issue date: August 02, 2021
(5) Maturity date: August 02, 2026
(6) Tenor: 5 Years
(7) Coupon rate: 0.61%
(8) The bond is subject to selling restrictions.
3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index).
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