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General Stock Board Listed Company Profile

6147 CHIPBOND
中文
Company Profile
Chairman CEO Spokesperson Tel Address Date of Listing (Regular)
Fei-Jain Wu Gou Huoo-Wen Vincent Lo (03)567-8788   No 3,Li Hsin 5 Rd.,Science-Based Industrial Park  Hsinchu,Taiwan,R.O.C. 2002/01/31
Industry Main Business
Semiconductor Founded in Jan. 1997 by semiconducter industry veterans,Chipbond Technology was the early pioneer in Taiwan to provide wafer bumping services and has become the largest Au bumping supplier in the world. Both Gold bumping snd Solder bumping services are available for customers' advanced packaging technology requirements. In addition to wafer bumping,Chipbond is also providing TCP,COFand COG turnkey solution especially for TN/STN/OLED/PDP dispaly driver IC industry.
 
Market Information ( 2021/12/03 )
Shr. Vol. Highest Lowest Closed Change Transaction TurnOver(%) long
margin
balance
(1,000shr.)
Short
margin
balance
(1,000shr.)
5002.661 68.30  67.30  67.60  -0.20  3016 0.67 14,415 229
Trading method Fun
purchase
price or
securities
pneeded
on T day
Announcement of Irregularity
(2021/12/06)
TPEx measures
adopted
(2021/12/06)
With warrants Can be shorted or margined? Detail
Normal N N N Y Y Today History
 
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 Auditor's report on latest financial statements: auditor's report:
 More detail:MOPS
 Foreign issuers’ information is disclosed in consolidated statements.