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Company Profile | ||||||||
Chairman | CEO | Spokesperson | Tel | Address | Date of Listing (Regular) | |||
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Fei-Jain Wu | Gou Huoo-Wen | Vincent Lo | (03)567-8788 | No 3,Li Hsin 5 Rd.,Science-Based Industrial Park Hsinchu,Taiwan,R.O.C. | 2002/01/31 | |||
Industry | Main Business | |||||||
Semiconductor | Founded in Jan. 1997 by semiconducter industry veterans,Chipbond Technology was the early pioneer in Taiwan to provide wafer bumping services and has become the largest Au bumping supplier in the world. Both Gold bumping snd Solder bumping services are available for customers' advanced packaging technology requirements. In addition to wafer bumping,Chipbond is also providing TCP,COFand COG turnkey solution especially for TN/STN/OLED/PDP dispaly driver IC industry. |
Market Information ( 2024/05/03 ) | |||||||||||
Shr. Vol. | Highest | Lowest | Closed | Change | Transaction | TurnOver(%) | long margin balance (1,000shr.) |
Short margin balance (1,000shr.) |
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4918.762 | 78.40 | 77.30 | 77.90 | 0.60 | 2894 | .00 | 3,322 | 251 | |||
Trading method | Fun purchase price or securities pneeded on T day |
Announcement of Irregularity (2024/05/03) |
TPEx measures adopted (2024/05/03) |
With warrants | Can be shorted or margined? | Detail | |||||
Normal | N | N | N | Y | Y | Today | History |
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Auditor's report on latest financial statements: auditor's report: |
More detail:MOPS。 |
Foreign issuers’ information is disclosed in consolidated statements. |