| Date: | 2021/11/05 |
|---|---|
| Document No. | 11000121931 |
| Title: | APEX SCIENCE&ENGINEERING CORP. 1st Secured Corporate Bond Issue in 2021 will be listed on the TPEx from November 09, 2021. |
| Description: | 1. Issuer: APEX SCIENCE & ENGINEERING CORP. 2. Bond Name: APEX SCIENCE&ENGINEERING CORP. 1st Secured Corporate Bond Issue in 2021 (1) Code: B86802 (2) Issue amount: TWD 0.50 Billion (3) Issue price: 100% (4) Issue date: November 09, 2021 (5) Maturity date: November 09, 2026 (6) Tenor: 5 Years (7) Coupon rate: 0.56% (8) The bond is subject to selling restrictions. 3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |