| Date: | 2022/05/16 |
|---|---|
| Document No. | 11100044011 |
| Title: | 2022-1 Secured Corporate Bond of Lien Hwa Industrial Holdings Corporation will be listed on the TPEx from May 17, 2022. |
| Description: | 1. Issuer: Lien Hwa Industrial Holdings Corporation 2. Bond Name: 2022-1 Secured Corporate Bond-A of Lien Hwa Industrial Holdings Corporation (1) Code: B30804 (2) Issue amount: TWD 1.20 Billion (3) Issue price: 100% (4) Issue date: May 17, 2022 (5) Maturity date: May 17, 2027 (6) Tenor: 5 Years (7) Coupon rate: 1.30% (8) The bond is subject to selling restrictions. 3. Bond Name: 2022-1 Secured Corporate Bond-B of Lien Hwa Industrial Holdings Corporation (1) Code: B30805 (2) Issue amount: TWD 1.30 Billion (3) Issue price: 100% (4) Issue date: May 17, 2022 (5) Maturity date: May 17, 2027 (6) Tenor: 5 Years (7) Coupon rate: 1.30% (8) The bond is subject to selling restrictions. 4. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |