| Date: | 2024/04/23 |
|---|---|
| Document No. | 11300026511 |
| Title: | Hon Hai Precision Industry Co., Ltd 2nd Unsecured Corporate Bonds Issue in 2024 with 4 tranches will be listed on TPEx from April 25, 2024. |
| Description: | 1. Issuer: Hon Hai Precision Industry Co., Ltd 2. Bond Name: Hon Hai Precision Industry Co., Ltd 2nd Unsecured Corporate Bonds-A Issue in 2024 (1) Code: B644D8 (2) Issue amount: TWD 1.15 billion (3) Issue price: 100% (4) Issue date: April 25, 2024 (5) Maturity date: April 25, 2027 (6) Tenor: 3 years (7) Coupon rate: 1.70% (8) The bond is subject to selling restrictions. 3. Bond Name: Hon Hai Precision Industry Co., Ltd 2nd Unsecured Corporate Bonds-B Issue in 2024 (1) Code: B644D9 (2) Issue amount: TWD 4.95 billion (3) Issue price: 100% (4) Issue date: April 25, 2024 (5) Maturity date: April 25, 2029 (6) Tenor: 5 years (7) Coupon rate: 1.80% (8) The bond is subject to selling restrictions. 4. Bond Name: Hon Hai Precision Industry Co., Ltd 2nd Unsecured Corporate Bonds-C Issue in 2024 (1) Code: B644DA (2) Issue amount: TWD 0.3 billion (3) Issue price: 100% (4) Issue date: April 25, 2024 (5) Maturity date: April 25, 2031 (6) Tenor: 7 years (7) Coupon rate: 1.84% (8) The bond is subject to selling restrictions. 5. Bond Name: Hon Hai Precision Industry Co., Ltd 2nd Unsecured Corporate Bonds-D Issue in 2024 (1) Code: B644DB (2) Issue amount: TWD 1.6 billion (3) Issue price: 100% (4) Issue date: April 25, 2024 (5) Maturity date: April 25, 2034 (6) Tenor: 10 years (7) Coupon rate: 1.90% (8) The bond is subject to selling restrictions. 6. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |