| Date: | 2024/04/26 |
|---|---|
| Document No. | 11300027761 |
| Title: | Megawin Technology Co., Ltd. 2nd Domestic Unsecured Convertible Bond will be listed on the TPEx from May 3, 2024. |
| Description: | 1. Issuer: Megawin Technology Co.,Ltd. 2. Bond name: Megawin Technology Co., Ltd. 2nd Domestic Unsecured Convertible Bond (1) Code: 31222 (2) Issue amount: TWD 200 million (3) Issue price: 101% (TWD 101) (4) Issue date: May 3, 2024 (5) Maturity date: May 3, 2027 (6) Tenor: 3 years (7) Coupon rate: 0% 3. For the full terms and conditions of the Bond, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |